Full turnkey operation from PCB design to PCB manufacture to component procurement to PCB assembly on request.

PCB CAPABILITIES
PCB WORLD SOLUTIONS
GENERAL
MATERIAL
DIMENSION & THICKNESS

Hole Diameter Tolerance

PTH ◆
NPTH ◆

◆ ± 0.076mm (± 3mil)

◆ ± 0.051mm (± 2mil)

Maximum Countersink Diameter (When Top Angle is 165 ̊)

◆ 6.35mm (0.25")

HOLE & SLOT

Slot Width

Minimum ◆

◆ 0.5mm (0.020")

◆ 0.102mm (3oz)

◆ 0.012mm (1/3oz)

Base Copper Thickness of Outer Layer

Maximum ◆
 Minimum ◆

Maximum Aspect Ratio of Plated Hole

◆ 8 : 1

Base Copper Thickness of Inner Layer

Maximum ◆
Minimum ◆

◆ 0.175mm (5oz)

◆ 0.017mm (1/2oz)

COPPER THICKNESS

Number of Layers

1-20 layers

◆ Gold finger
◆ Tented Via
◆ Blind & Buried Via
◆ Impedance Control
◆ Carbon Ink
◆ Peelable Mask / Kapton

◆ Counter Sink

Special Treatment

Base Material

◆ CEM-3
◆ FR-4 (TG > 130 °C, 150 °C, 170 °C)

◆ FR-4 (Halogen-free)

◆ KB-6160
◆ S1141
◆ IT-140, IT-158, IT-180

Current Suppliers

KINGBOARD ◆

 SHENGYI ◆
 ITEQ ◆

Board Thickness

Maximum ◆
Minimum ◆

◆ 3.2mm (0.126")

◆ 0.4mm (0.016")

◆ 584 X 813mm (23 X 32")

Board Size

 Maximum ◆

◆ ± 10%
◆ ± 0.076mm (± 3mil)

Finished Board Thickness Tolerance
Board Thickness ≥ 0.8 mm ◆
 0.4 mm ≤ Board Thickness < 0.8 mm ◆

◆ 0.1mm (0.0039")

Minimum Core Thickness

◆ ± 0.076mm (± 3mil)

Minimum Dielectric Thickness of Inner Layer

Maximum Warp & Twist

◆ 0.7%

Drilling Diameter

Maximum ◆
 Minimum ◆

◆ 6.4mm (0.252")
◆ 0.20mm (0.0079")

Finished Diameter

Minimum ◆

◆ 0.102mm (4mil)

Minimum Hole to Hole Distance

◆ 0.305mm (12 mil)

◆ ± 0.076mm (± 3mil)

◆ ± 0.102mm (± 4mil)

◆ ± 0.076mm (± 3mil)

◆ ± 0.204mm (± 8mil)

◆ ± 0.152mm (± 6mil)

Hole Position Tolerance
Compared with CAD data ◆
Hole to Hole with Ф < 1.0mm ◆

Hole to Hole with Ф ≥ 1.0mm ◆

Hole to Edge with Ф < 1.0mm ◆

Hole to Edge with Ф ≥ 1.0mm ◆

Slot Tolerance
PTH with Length ≥ 2 X Width + 0.15mm ◆

PTH with Length < 2 X Width + 0.15mm ◆

NPTH ◆

◆ ± 0.102mm (± 4mil)

◆ ± 0.127mm (± 5mil)

◆ ± 0.076mm (± 3mil)

◆ ≥ 0.020mm (≥ 0.8mil)

Copper Thickness of PTH Wall (SMOBC)

◆ 0.089mm / 0.089mm (3.5mil / 3.5mil)

◆ 0.089mm / 0.089mm (3.5mil / 3.5mil)

◆ 0.102mm / 0.102mm (4mil / 4mil)
◆ 0.127mm / 0.127mm (5mil / 5mil)

◆ 0.152mm / 0.152mm (6mil / 6mil)

Minimum Design Line Width / Space in Outer Layer

T / T oz (1/3oz) ◆
H / H oz (1/2oz) ◆
1 / 1 oz ◆

2 / 2 oz ◆

3 / 3 oz ◆

◆ 0.089mm / 0.089mm (3.5mil / 3.5mil)

◆ 0.102mm / 0.102mm (4mil / 4mil)
◆ 0.127mm / 0.127mm (5mil / 5mil)
◆ 0.152mm / 0.152mm (6mil / 6mil)

◆ 0.229mm / 0.229mm (9mil / 9mil)

Minimum Design Line Width / Space in Inner Layer

H / H oz (1/2oz) ◆
 1 / 1 oz ◆
 2 / 2 oz ◆

3 / 3 oz ◆

 5 / 5 oz ◆

◆ ± 10%

◆ ± 20%

Tolerance After Etching

 H / H oz (1/2oz) ◆
 1 / 1 oz ◆

◆ ± 5Ω

◆ ± 10%

Impedance Tolerance

≤ 50 Ω ◆
> 50 Ω ◆

CIRCUITRY

◆ ± 0.127mm (± 5mil)

◆ ± 0.102mm (± 4mil)

◆ ± 0.152mm (± 6mil)

◆ ± 0.254mm (± 10mil)

Position Tolerance (Minimum)
 Image to Image ◆
 Image to Hole ◆
 Image to Outline (Outer Layer) ◆

 Image to Outline (Inner Layer) ◆

SOLDERMASK

◆ Green (Matt or Glossy)

◆ Black (Matt or Glossy)

◆ White
◆ Blue

◆ Red

◆ Yellow

Colours

◆ ± 0.05mm (± 2mil)

Soldermask Registration

◆ 10μm

Minimum Soldermask Thickness

◆ Soldermask in Hole
◆ Solder Ball on One Side

◆ No Solder Ball

Soldermask Plugging Hole Diameter

 Ф > 0.75mm ◆
 0.55mm > Ф ≥ 0.75mm ◆
 Ф ≤ 0.55mm ◆

◆ 0.076mm (3mil)

Minimum Soldermask Bridge

LEGEND

◆ White

◆ Black

◆ Yellow

Colours

◆ 0.102mm (4mil)

Legend Registration

◆ 0.635mm (25mil)

◆ 0.381mm (15mil)

Legend on Circuit

 Height ◆
 Width ◆

◆ 0.102mm (4mil)

Legend Line Width

◆ 0.559mm (22mil)

◆ 0.330mm (13mil)

Legend on Large Copper or Lamination

 Height ◆
Width ◆

◆ 0.127mm (5mil)

Minimum Letter Width of Soldermask Opening

◆ 2.54 - 5μm (102 - 200μin)

◆ 0.0254 - 0.102μm (1 - 4μin)

Thickness for ENIG (Measured at the Minimum Point)

Nickel (Ni) ◆
Gold (Au) ◆

◆ 0.15 - 0.3μm (6 - 12μin)

Thickness for Immersion Silver

(Measured at the Minimum Point)

 Silver (Ag) ◆

PLATING

◆ 0.5 - 1.0μm (20 - 40μin)

Thickness for Immersion Tin

(Measured at the Minimum Point)

 Tin (Sn) ◆

◆ 0.2 - 0.3μm (8 - 12μin)

Thickness for OSP (Measured at the Minimum Point)

◆ 20Ω / cm2

Carbon Ink Resistance

◆ 0.375mm (15mil)

Minimum Space for Carbon Conductor

◆ 0.076mm (3mil)

◆ 0.203mm (8mil)

Minimum Test PAD Width

 Flying Probe Machine ◆

 E-tester Machine ◆

◆ 0.05mm (2mil)

Minimum AOI Test Line

E-Test

◆ 620 X 650mm (24.4 x 25.6")

Maximum AOI Test Dimension

Outline (Punching / Routing / V-cut)

◆ ± 0.102mm (± 4mil)

◆ ± 0.102mm (± 4mil)

Minimum Routing Dimension Tolerance

 Edge to Edge ◆
 Hole to Edge ◆

◆ ± 0.203mm (± 8mil)

◆ ± 0.178mm (± 7mil)

Minimum Punching Dimension Tolerance

 Edge to Edge ◆
 Hole to Edge ◆

◆ 0.61mm (24mil)

Minimum Board Thickness that can be V-cut

◆ 0.40mm (16mil)

Minimum Radius by Routing (Internal Angle)

◆ 457mm (18")

Maximum Distance between V-cut and Board Edge

◆ ± 5 ̊
◆ ± 0.102mm (± 4mil)

◆ ± 0.127mm (± 5mil)

◆ ± 0.152mm (± 6mil)

◆ ± 0.127mm (± 5mil)

V-cut Tolerance (Minimum)

 Angle (30 ̊ - 60 ̊) ◆
 Remaining Thickness ◆
 Mis-Registration ◆

 V-cut to Hole ◆

 V-cut to V-cut ◆

 

PCB World Solutions Pty Ltd

U1 - 45 Douglas Drive, Technology Park, Mawson Lakes, S.A. 5095.

Phone (7 days): (08) 8260 3799   

Mobile: 0423 968 590   

Email: stuart@pcbws.com.au
ACN 099 310 684   ABN 80 167 720 426