​Full turnkey operation from PCB design to PCB manufacture to component procurement to PCB assembly on request.
PCB CAPABILITIES
PCB WORLD SOLUTIONS
GENERAL
MATERIAL
DIMENSION & THICKNESS
Hole Diameter Tolerance
PTH â—†
NPTH â—†
â—† ± 0.076mm (± 3mil)
â—† ± 0.051mm (± 2mil)
Maximum Countersink Diameter (When Top Angle is 165 ÌŠ)
â—† 6.35mm (0.25")
HOLE & SLOT
Slot Width
Minimum â—†
â—† 0.5mm (0.020")
â—† 0.102mm (3oz)
â—† 0.012mm (1/3oz)
Base Copper Thickness of Outer Layer
Maximum â—†
Minimum â—†
Maximum Aspect Ratio of Plated Hole
â—† 8 : 1
Base Copper Thickness of Inner Layer
Maximum â—†
Minimum â—†
â—† 0.175mm (5oz)
â—† 0.017mm (1/2oz)
COPPER THICKNESS
Number of Layers
1-20 layers
â—† Gold finger
â—† Tented Via
â—† Blind & Buried Via
â—† Impedance Control
â—† Carbon Ink
â—† Peelable Mask / Kapton
â—† Counter Sink
Special Treatment
Base Material
â—† CEM-3
â—† FR-4 (TG > 130 °C, 150 °C, 170 °C)
â—† FR-4 (Halogen-free)
â—† KB-6160
â—† S1141
â—† IT-140, IT-158, IT-180
Current Suppliers
KINGBOARD â—†
SHENGYI â—†
ITEQ â—†
Board Thickness
Maximum â—†
Minimum â—†
â—† 3.2mm (0.126")
â—† 0.4mm (0.016")
â—† 584 X 813mm (23 X 32")
Board Size
Maximum â—†
â—† ± 10%
â—† ± 0.076mm (± 3mil)
Finished Board Thickness Tolerance
Board Thickness ≥ 0.8 mm â—†
0.4 mm ≤ Board Thickness < 0.8 mm â—†
â—† 0.1mm (0.0039")
Minimum Core Thickness
â—† ± 0.076mm (± 3mil)
Minimum Dielectric Thickness of Inner Layer
Maximum Warp & Twist
â—† 0.7%
Drilling Diameter
Maximum â—†
Minimum â—†
â—† 6.4mm (0.252")
â—† 0.20mm (0.0079")
Finished Diameter
Minimum â—†
â—† 0.102mm (4mil)
Minimum Hole to Hole Distance
â—† 0.305mm (12 mil)
â—† ± 0.076mm (± 3mil)
â—† ± 0.102mm (± 4mil)
â—† ± 0.076mm (± 3mil)
â—† ± 0.204mm (± 8mil)
â—† ± 0.152mm (± 6mil)
Hole Position Tolerance
Compared with CAD data â—†
Hole to Hole with Ф < 1.0mm ◆
Hole to Hole with Ф ≥ 1.0mm â—†
Hole to Edge with Ф < 1.0mm ◆
Hole to Edge with Ф ≥ 1.0mm â—†
Slot Tolerance
PTH with Length ≥ 2 X Width + 0.15mm â—†
PTH with Length < 2 X Width + 0.15mm â—†
NPTH â—†
â—† ± 0.102mm (± 4mil)
â—† ± 0.127mm (± 5mil)
â—† ± 0.076mm (± 3mil)
â—† ≥ 0.020mm (≥ 0.8mil)
Copper Thickness of PTH Wall (SMOBC)
â—† 0.089mm / 0.089mm (3.5mil / 3.5mil)
â—† 0.089mm / 0.089mm (3.5mil / 3.5mil)
â—† 0.102mm / 0.102mm (4mil / 4mil)
â—† 0.127mm / 0.127mm (5mil / 5mil)
â—† 0.152mm / 0.152mm (6mil / 6mil)
Minimum Design Line Width / Space in Outer Layer
T / T oz (1/3oz) â—†
H / H oz (1/2oz) â—†
1 / 1 oz â—†
2 / 2 oz â—†
3 / 3 oz â—†
â—† 0.089mm / 0.089mm (3.5mil / 3.5mil)
â—† 0.102mm / 0.102mm (4mil / 4mil)
â—† 0.127mm / 0.127mm (5mil / 5mil)
â—† 0.152mm / 0.152mm (6mil / 6mil)
â—† 0.229mm / 0.229mm (9mil / 9mil)
Minimum Design Line Width / Space in Inner Layer
H / H oz (1/2oz) â—†
1 / 1 oz â—†
2 / 2 oz â—†
3 / 3 oz â—†
5 / 5 oz â—†
â—† ± 10%
â—† ± 20%
Tolerance After Etching
H / H oz (1/2oz) â—†
1 / 1 oz â—†
â—† ± 5Ω
â—† ± 10%
Impedance Tolerance
≤ 50 Ω â—†
> 50 Ω â—†
CIRCUITRY
â—† ± 0.127mm (± 5mil)
â—† ± 0.102mm (± 4mil)
â—† ± 0.152mm (± 6mil)
â—† ± 0.254mm (± 10mil)
Position Tolerance (Minimum)
Image to Image â—†
Image to Hole â—†
Image to Outline (Outer Layer) â—†
Image to Outline (Inner Layer) â—†
SOLDERMASK
â—† Green (Matt or Glossy)
â—† Black (Matt or Glossy)
â—† White
â—† Blue
â—† Red
â—† Yellow
Colours
â—† ± 0.05mm (± 2mil)
Soldermask Registration
â—† 10μm
Minimum Soldermask Thickness
â—† Soldermask in Hole
â—† Solder Ball on One Side
â—† No Solder Ball
Soldermask Plugging Hole Diameter
Ф > 0.75mm ◆
0.55mm > Ф ≥ 0.75mm â—†
Ф ≤ 0.55mm â—†
â—† 0.076mm (3mil)
Minimum Soldermask Bridge
LEGEND
â—† White
â—† Black
â—† Yellow
Colours
â—† 0.102mm (4mil)
Legend Registration
â—† 0.635mm (25mil)
â—† 0.381mm (15mil)
Legend on Circuit
Height â—†
Width â—†
â—† 0.102mm (4mil)
Legend Line Width
â—† 0.559mm (22mil)
â—† 0.330mm (13mil)
Legend on Large Copper or Lamination
Height â—†
Width â—†
â—† 0.127mm (5mil)
Minimum Letter Width of Soldermask Opening
â—† 2.54 - 5μm (102 - 200μin)
â—† 0.0254 - 0.102μm (1 - 4μin)
Thickness for ENIG (Measured at the Minimum Point)
Nickel (Ni) â—†
Gold (Au) â—†
â—† 0.15 - 0.3μm (6 - 12μin)
Thickness for Immersion Silver
(Measured at the Minimum Point)
Silver (Ag) â—†
PLATING
â—† 0.5 - 1.0μm (20 - 40μin)
Thickness for Immersion Tin
(Measured at the Minimum Point)
Tin (Sn) â—†
â—† 0.2 - 0.3μm (8 - 12μin)
Thickness for OSP (Measured at the Minimum Point)
â—† 20Ω / cm2
Carbon Ink Resistance
â—† 0.375mm (15mil)
Minimum Space for Carbon Conductor
â—† 0.076mm (3mil)
â—† 0.203mm (8mil)
Minimum Test PAD Width
Flying Probe Machine â—†
E-tester Machine â—†
â—† 0.05mm (2mil)
Minimum AOI Test Line
E-Test
â—† 620 X 650mm (24.4 x 25.6")
Maximum AOI Test Dimension
Outline (Punching / Routing / V-cut)
â—† ± 0.102mm (± 4mil)
â—† ± 0.102mm (± 4mil)
Minimum Routing Dimension Tolerance
Edge to Edge â—†
Hole to Edge â—†
â—† ± 0.203mm (± 8mil)
â—† ± 0.178mm (± 7mil)
Minimum Punching Dimension Tolerance
Edge to Edge â—†
Hole to Edge â—†
â—† 0.61mm (24mil)
Minimum Board Thickness that can be V-cut
â—† 0.40mm (16mil)
Minimum Radius by Routing (Internal Angle)
â—† 457mm (18")
Maximum Distance between V-cut and Board Edge
â—† ± 5 ÌŠ
â—† ± 0.102mm (± 4mil)
â—† ± 0.127mm (± 5mil)
â—† ± 0.152mm (± 6mil)
â—† ± 0.127mm (± 5mil)
V-cut Tolerance (Minimum)
Angle (30 ÌŠ - 60 ÌŠ) â—†
Remaining Thickness â—†
Mis-Registration â—†
V-cut to Hole â—†
V-cut to V-cut â—†