PCB World Solutions Pty Ltd

U1 - 45 Douglas Drive, Technology Park, Mawson Lakes, S.A. 5095.

Phone (7 days): (08) 8260 3799   

Mobile: 0423 968 590   

Email: stuart@pcbws.com.au
ACN 099 310 684   ABN 80 167 720 426

Full turnkey operation from PCB design to PCB manufacture to component procurement to PCB assembly on request.

PCB CAPABILITIES
PCB WORLD SOLUTIONS
GENERAL
MATERIAL
DIMENSION & THICKNESS

Hole Diameter Tolerance

PTH ◆
NPTH ◆

◆ ± 0.076mm (± 3mil)

◆ ± 0.051mm (± 2mil)

Maximum Countersink Diameter (When Top Angle is 165 ̊)

◆ 6.35mm (0.25")

HOLE & SLOT

Slot Width

Minimum ◆

◆ 0.5mm (0.020")

◆ 0.102mm (3oz)

◆ 0.012mm (1/3oz)

Base Copper Thickness of Outer Layer

Maximum ◆
 Minimum ◆

Maximum Aspect Ratio of Plated Hole

◆ 8 : 1

Base Copper Thickness of Inner Layer

Maximum ◆
Minimum ◆

◆ 0.175mm (5oz)

◆ 0.017mm (1/2oz)

COPPER THICKNESS

Number of Layers

1-20 layers

◆ Gold finger
◆ Tented Via
◆ Blind & Buried Via
◆ Impedance Control
◆ Carbon Ink
◆ Peelable Mask / Kapton

◆ Counter Sink

Special Treatment

Base Material

◆ CEM-3
◆ FR-4 (TG > 130 °C, 150 °C, 170 °C)

◆ FR-4 (Halogen-free)

◆ KB-6160
◆ S1141
◆ IT-140, IT-158, IT-180

Current Suppliers

KINGBOARD ◆

 SHENGYI ◆
 ITEQ ◆

Board Thickness

Maximum ◆
Minimum ◆

◆ 3.2mm (0.126")

◆ 0.4mm (0.016")

◆ 584 X 813mm (23 X 32")

Board Size

 Maximum ◆

◆ ± 10%
◆ ± 0.076mm (± 3mil)

Finished Board Thickness Tolerance
Board Thickness ≥ 0.8 mm ◆
 0.4 mm ≤ Board Thickness < 0.8 mm ◆

◆ 0.1mm (0.0039")

Minimum Core Thickness

◆ ± 0.076mm (± 3mil)

Minimum Dielectric Thickness of Inner Layer

Maximum Warp & Twist

◆ 0.7%

Drilling Diameter

Maximum ◆
 Minimum ◆

◆ 6.4mm (0.252")
◆ 0.20mm (0.0079")

Finished Diameter

Minimum ◆

◆ 0.102mm (4mil)

Minimum Hole to Hole Distance

◆ 0.305mm (12 mil)

◆ ± 0.076mm (± 3mil)

◆ ± 0.102mm (± 4mil)

◆ ± 0.076mm (± 3mil)

◆ ± 0.204mm (± 8mil)

◆ ± 0.152mm (± 6mil)

Hole Position Tolerance
Compared with CAD data ◆
Hole to Hole with Ф < 1.0mm ◆

Hole to Hole with Ф ≥ 1.0mm ◆

Hole to Edge with Ф < 1.0mm ◆

Hole to Edge with Ф ≥ 1.0mm ◆

Slot Tolerance
PTH with Length ≥ 2 X Width + 0.15mm ◆

PTH with Length < 2 X Width + 0.15mm ◆

NPTH ◆

◆ ± 0.102mm (± 4mil)

◆ ± 0.127mm (± 5mil)

◆ ± 0.076mm (± 3mil)

◆ ≥ 0.020mm (≥ 0.8mil)

Copper Thickness of PTH Wall (SMOBC)

◆ 0.089mm / 0.089mm (3.5mil / 3.5mil)

◆ 0.089mm / 0.089mm (3.5mil / 3.5mil)

◆ 0.102mm / 0.102mm (4mil / 4mil)
◆ 0.127mm / 0.127mm (5mil / 5mil)

◆ 0.152mm / 0.152mm (6mil / 6mil)

Minimum Design Line Width / Space in Outer Layer

T / T oz (1/3oz) ◆
H / H oz (1/2oz) ◆
1 / 1 oz ◆

2 / 2 oz ◆

3 / 3 oz ◆

◆ 0.089mm / 0.089mm (3.5mil / 3.5mil)

◆ 0.102mm / 0.102mm (4mil / 4mil)
◆ 0.127mm / 0.127mm (5mil / 5mil)
◆ 0.152mm / 0.152mm (6mil / 6mil)

◆ 0.229mm / 0.229mm (9mil / 9mil)

Minimum Design Line Width / Space in Inner Layer

H / H oz (1/2oz) ◆
 1 / 1 oz ◆
 2 / 2 oz ◆

3 / 3 oz ◆

 5 / 5 oz ◆

◆ ± 10%

◆ ± 20%

Tolerance After Etching

 H / H oz (1/2oz) ◆
 1 / 1 oz ◆

◆ ± 5Ω

◆ ± 10%

Impedance Tolerance

≤ 50 Ω ◆
> 50 Ω ◆

CIRCUITRY

◆ ± 0.127mm (± 5mil)

◆ ± 0.102mm (± 4mil)

◆ ± 0.152mm (± 6mil)

◆ ± 0.254mm (± 10mil)

Position Tolerance (Minimum)
 Image to Image ◆
 Image to Hole ◆
 Image to Outline (Outer Layer) ◆

 Image to Outline (Inner Layer) ◆

SOLDERMASK

◆ Green (Matt or Glossy)

◆ Black (Matt or Glossy)

◆ White
◆ Blue

◆ Red

◆ Yellow

Colours

◆ ± 0.05mm (± 2mil)

Soldermask Registration

◆ 10μm

Minimum Soldermask Thickness

◆ Soldermask in Hole
◆ Solder Ball on One Side

◆ No Solder Ball

Soldermask Plugging Hole Diameter

 Ф > 0.75mm ◆
 0.55mm > Ф ≥ 0.75mm ◆
 Ф ≤ 0.55mm ◆

◆ 0.076mm (3mil)

Minimum Soldermask Bridge

LEGEND

◆ White

◆ Black

◆ Yellow

Colours

◆ 0.102mm (4mil)

Legend Registration

◆ 0.635mm (25mil)

◆ 0.381mm (15mil)

Legend on Circuit

 Height ◆
 Width ◆

◆ 0.102mm (4mil)

Legend Line Width

◆ 0.559mm (22mil)

◆ 0.330mm (13mil)

Legend on Large Copper or Lamination

 Height ◆
Width ◆

◆ 0.127mm (5mil)

Minimum Letter Width of Soldermask Opening

◆ 2.54 - 5μm (102 - 200μin)

◆ 0.0254 - 0.102μm (1 - 4μin)

Thickness for ENIG (Measured at the Minimum Point)

Nickel (Ni) ◆
Gold (Au) ◆

◆ 0.15 - 0.3μm (6 - 12μin)

Thickness for Immersion Silver

(Measured at the Minimum Point)

 Silver (Ag) ◆

PLATING

◆ 0.5 - 1.0μm (20 - 40μin)

Thickness for Immersion Tin

(Measured at the Minimum Point)

 Tin (Sn) ◆

◆ 0.2 - 0.3μm (8 - 12μin)

Thickness for OSP (Measured at the Minimum Point)

◆ 20Ω / cm2

Carbon Ink Resistance

◆ 0.375mm (15mil)

Minimum Space for Carbon Conductor

◆ 0.076mm (3mil)

◆ 0.203mm (8mil)

Minimum Test PAD Width

 Flying Probe Machine ◆

 E-tester Machine ◆

◆ 0.05mm (2mil)

Minimum AOI Test Line

E-Test

◆ 620 X 650mm (24.4 x 25.6")

Maximum AOI Test Dimension

Outline (Punching / Routing / V-cut)

◆ ± 0.102mm (± 4mil)

◆ ± 0.102mm (± 4mil)

Minimum Routing Dimension Tolerance

 Edge to Edge ◆
 Hole to Edge ◆

◆ ± 0.203mm (± 8mil)

◆ ± 0.178mm (± 7mil)

Minimum Punching Dimension Tolerance

 Edge to Edge ◆
 Hole to Edge ◆

◆ 0.61mm (24mil)

Minimum Board Thickness that can be V-cut

◆ 0.40mm (16mil)

Minimum Radius by Routing (Internal Angle)

◆ 457mm (18")

Maximum Distance between V-cut and Board Edge

◆ ± 5 ̊
◆ ± 0.102mm (± 4mil)

◆ ± 0.127mm (± 5mil)

◆ ± 0.152mm (± 6mil)

◆ ± 0.127mm (± 5mil)

V-cut Tolerance (Minimum)

 Angle (30 ̊ - 60 ̊) ◆
 Remaining Thickness ◆
 Mis-Registration ◆

 V-cut to Hole ◆

 V-cut to V-cut ◆